SEMICONDUCTOR

SMART SEMICONDUCTOR SERIES

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OUR CLEANROOM MACHINE SOLUTION SUITE

Pixel Automation offers a range of SMART Semiconductor Cleanroom Machine to serve the needs of our Semiconductor Customer.

Our solution suite includes the following:

  1. Non-Contact Gauge (NCG) Wafer Overall Thickness Measurement
  2. Non-Contact Gauge (NCG) Wafer Layer Thickness Measurement
  3. Wafer Sorter
  4. Wafer Transfer Tool, Labeler
  5. SAP Lot Creation Tool
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SEMICONDUCTOR WAFER HANDLING SYSTEM

Semiconductor manufacturers are often being challenged in finding new, innovative and more efficient ways to automate the wafer handling process. Wafers come in a range of shapes and sizes, which had led to the need of various different handling requirements. Hence, figuring out an appropriate handling solution can sometimes pose a timely and costly challenge for manufacturers.

TECHNICAL CAPABILITIES

In Pixel Automation, regardless of the complexity of the wafer handling requirement or the need in integrating automation into your current process tool, we strive to address your needs. Our proven technical experience and deep understanding of wafer handling automation and factory integration requirements have enabled us to develop wafer handling equipment that addresses all your project needs.

We design and build reliable, industry-trusted semiconductor wafer handling systems for numerous world’s leading semiconductor manufacturers around the globe, be it a turnkey Equipment Front End Module (EFEM) or a fully customized wafer handling solution — our wafer handling know-how will ensure you a success in your next automation project.

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Automated Wafer Thickness Measurement Tool

Description :

100% Non-Contact Wafer Thickness Measurement Tool to enable hands free wafer measurement process with high measurement accuracy of up to 2 micron.

Key Challenges

  • To handle wafer range from 4” to 12”. 
  • Light sensor to measure planarity thickness with accuracy of 2 micron.
  • Laser sensor measure layer thickness with accuracy of 2 micron.
  • To handle wafer with 2mm warpage.

Automated Wafer Layer Thickness Measurement Tool

Description :

Direct measurement of layer thickness, which is not feasible with traditional contact measurement.

100% Non-Contact Wafer Layer Thickness Measurement Tool with class 3 laser measurement sensor to enable hands free wafer layer measurement with high measurement accuracy of up to 2 micron.

Key Challenges

  • To handle wafer range from 4” to 12”.
  • 100% wafer measurement with 100% data traceability.
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Automated Wafer Transfer and SAP Lot Creation Tool

Description :

Automated Wafer Transfer and Lot Creation in SAP Interface via key stroke feature.
100% Non-Contact Wafer Transfer hands free wafer handling process.
100% Wafer ID read and traceability with 100% data traceability

Key Challenges

  • To handle wafer range from 4” to 12”.
  • Direct interface with SAP is prohibited. Innovative way in interfacing with ERP level system via key stroke program in addressing customers’ needs.

Automated Dicing Ring Labeler Tool

Description :

Automated Dicing Ring Labeler to enable 100% Non-Contact and hands free Wafer labeling process.

100% Wafer ID read and traceability with 100% data traceability

Key Challenges

  • To handle wafer range from 4” to 12”.
  • Require high accuracy of labeling position with <1mm positioning error allowed.
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Automated Metrology Inspection Tool

Description :

Automated Metrology Inspection Tool to enable 100% Non-Contact and hands free Wafer inspection process.

Key Challenges

  • To handle wafer range from 4” to 12”.
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CONTACT US

Pixel Automation Pte Ltd

10 Admiralty Street #04-13
North Link Building
Singapore 757695

Email: sales@pixel-automation.com.sg

Tel: +65 6852 8980