Semiconductor

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Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book. It has survived not only five centuries, but also the leap into electronic typesetting, remaining essentially unchanged. It was popularised in the 1960s with the release of Letraset sheets containing Lorem Ipsum passages, and more recently with desktop publishing software like Aldus PageMaker including versions of Lorem Ipsum.

Lorem Ipsum has been the industry’s standard dummy text ever since the 1500s, when an unknown printer took a galley of type and scrambled it to make a type specimen book. It has survived not only five centuries, but also the leap into electronic typesetting, remaining essentially unchanged. It was popularised in the 1960s with the release of Letraset sheets containing Lorem Ipsum passages, and more recently with desktop publishing software like Aldus PageMaker including versions of Lorem Ipsum.

Automated Wafer Thickness Measurement Tool

Description :

100% Non-Contact Wafer Thickness Measurement Tool to enable hands free wafer measurement process with high measurement accuracy of up to 2 micron.

Key Challenges

  • To handle wafer range from 4” to 12”. 
  • Light sensor to measure planarity thickness with accuracy of 2 micron.
  • Laser sensor measure layer thickness with accuracy of 2 micron.
  • To handle wafer with 2mm warpage.

Automated Wafer Layer Thickness Measurement Tool

Description :

Direct measurement of layer thickness, which is not feasible with traditional contact measurement.

100% Non-Contact Wafer Layer Thickness Measurement Tool with class 3 laser measurement sensor to enable hands free wafer layer measurement with high measurement accuracy of up to 2 micron.

Key Challenges

  • To handle wafer range from 4” to 12”.
  • 100% wafer measurement with 100% data traceability.

Automated Wafer Transfer and SAP Lot Creation Tool

Description :

Automated Wafer Transfer and Lot Creation in SAP Interface via key stroke feature.
100% Non-Contact Wafer Transfer hands free wafer handling process.
100% Wafer ID read and traceability with 100% data traceability

Key Challenges

  • To handle wafer range from 4” to 12”.
  • Direct interface with SAP is prohibited. Innovative way in interfacing with ERP level system via key stroke program in addressing customers’ needs.

Automated Dicing Ring Labeler Tool

Description :

Automated Dicing Ring Labeler to enable 100% Non-Contact and hands free Wafer labeling process.

100% Wafer ID read and traceability with 100% data traceability

Key Challenges

  • To handle wafer range from 4” to 12”.
  • Require high accuracy of labeling position with <1mm positioning error allowed.

Automated Metrology Inspection Tool

Description :

Automated Metrology Inspection Tool to enable 100% Non-Contact and hands free Wafer inspection process.

Key Challenges

  • To handle wafer range from 4” to 12”.

CONTACT US

Pixel Automation Pte Ltd

10 Admiralty Street #04-13
North Link Building
Singapore 757695

Email: sales@pixel-automation.com.sg

Tel: +65 6852 8980